3D Printing SiC for Semiconductor Manufacturing Equipment
The new possibilities of silicon carbide where imagination takes shape.
In the field of semiconductor manufacturing equipment, components that demonstrate stable performance in high-temperature environments are required. Particularly in precise processes, high heat resistance and dimensional stability are essential. Conventional manufacturing methods have limitations in the integrated molding of complex shapes and large components, but our 3D printing SiC addresses these challenges. Silicon carbide 'IntrinSiC®' is an excellent innovation aimed at the production of large and complex integrated structural components made from reaction-bonded silicon carbide (RBSiC). By combining the superior material properties of RBSiC with the process-specific advantages of 3D printing, it offers new structural design possibilities for the markets of ring graphing, measurement, and heat treatment technologies. [Application Scenarios] ■ High-temperature process chamber components ■ Vacuum transport equipment components ■ Precision measuring instrument components [Benefits of Implementation] ■ Reduction in assembly man-hours due to a decrease in the number of parts ■ Performance improvement due to complex shapes ■ Extended lifespan of equipment due to high heat resistance
- Company：シュンク・カーボン・テクノロジー・ジャパン
- Price：Other
